XCede® HD combines a small form factor with incredible design flexibility for significant board and system space savings. Skip to content. High Speed Cables & Connectors; HDTF - Samtec XCede® HD 1. 2. 80 mm高密度背板垂直插头. BENEFITS. Xcede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. 0” Long. 5 - Effective capacity assumes average 4:1 data reduction. Features a simple design, normal or reverse mounting, push-push insert style and a locking technology therefore preventing the card from falling out. XCede® BACKPLANE CONNECTOR SYSTEM - FCI. Amphenol Xcede Series High Speed/Modular Connectors are available at Mouser Electronics. 2 TB-2244 XCede HD Family Daughtercard Connector Press-Fit Installation Process 3. developers with a readily available robust solution for tighter card pitches and chassis designs where space requirements and density are critical. XCede Product Family Connector Press-fit Installation Process . DC configurations may also be determined by the XHD+ RAM connector to which they will mate for co-planar applications. See Figure 15 for details. Amphenol is one of the leading manufacturers of Backplane connectors. 1 DOCUMENTS 2. signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. 1. Offering a linear density of up to 84 differential pairs per inch and can meet requirements of high density architectures. 1 XCede HD 2 Pair Backplane With Extra Ground Customer Use Drawings C-923-201C-500 2 Pair, 6 Column Differential Backplane Module, Thick Wall XCede® HD backplane connector achieves high performance (up to 20Gb/s) in a hard metric form factor. Three levels of sequencing enable hot plugging. 0 REFERENCE 2. Accessories; Audio Products; CapacitorsAmphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 80 mm高密度背板垂直插头. XCEDE® BACKPLANE CONNECTOR SYSTEM XCEDE® POWER SYSTEM 150 grams normal force nominal POWER RATING Modular construction gives an effective current density of 8. 1. 4. Pin header. 63. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. XCede® connectors also. Click to download Certificate of. 1. XCede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. XCede® connectors also address. 2. FCI 159 KAMPONG AMPAT, KA, PLACE,. Check Pricing. 00 mm的触点滑动范围. Sign Up or Register. A HIGH-DENSITY, DIFFERENTIAL, LOW-COST CONNECTOR SOLUTION FOR DATA RATES UP TO 14 GBPS. 96 and 5. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Manufacturer of Connector and Connector Systems. Board-to-board connector / right-angle / female The XCede® Right-Angle Male (XCede® RAM) connector is an intelligent device that offers two options for designers. +44 (0)203 301 9900. Login or REGISTER Hello, {0}. Improves signal integrity and increases signal. Let’s take a look at a typical higher level motherboard for an example of connector and port types. 0225" Drill Compliant Pin Protrusion (mm) (negative numbers result in no protrusion) 0. 3-, 4- and 6-pair designs. Login or REGISTER Hello, {0}. XCede® connectors also address. 423-0155-500 MOUNTING BLOCK. Find Parts. DETAILS. Skip to Main Content (800) 346-6873. Copper Weight and Annular Ring (“A/R”) 8 Table 3: XCede® HD 21. Distance Graph showing two shapes of the knee area utilizing an 2 - One mezzanine card per node, mirrored ; 3 - Two IO Modules per node, mirrored. 2. signal connector (J_BP_SIG) 5. 1 XCede HD 2 Pair Backplane Customer Use Drawings C-923-201C-500 2 Pair, 6 Column Differential Backplane Module, Thick Wall C-923-201E-500 2 Pair, 8 Column Differential Backplane Module, Thick Wall高速、高密度背板系统包括了各种对数和列数的ExaMAX®和XCede® HD。ExaMAX®可实现高达56 Gbps的性能，并使设计师能够选择优化密度或最大程度地减少电路板层数。XCede® HD是一个采用模块化设计的小型系统，可大幅节省空间并提升灵活性。The XCede ® HD Plus backplane connector achieves high performance (up to 28+ Gb/s) in a Hard Metric form factor. Description Initial Date “-“ S1188 Initial Release T. Change LocationAmphenol TCS XCede® Backplane Connectors are designed to offer readily available 85Ω and 100Ω solutions while maintaining the same mating interfaces. High Speed / Modular Connectors XCede HD High-Density Backplane Custom Right-Angle Module BSP-226769-01; Samtec; 1: $29. 0A: 250V: EXTreme OrthoPowerНа страницах каталога оборудования вы найдете Connectors: board-to-board различных производителей - большой выбор оборудования и техники. 1. 10119128-B0C-40DLF Datasheets | Backplane Connectors - Specialized Connector Header, Male Pins and Blades Through Hole Black XCede®, Guide Left By apogeeweb, 10119128-b0c-40dlf, 10119128-b0c-40dlf datasheet,10119128. 99 $ 19. DDR SDRAM - Evolution of High-Performance Volatile Memory. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with coolingThis document describes the methods and tooling for the installation of Amphenol TCS XCede HD,XCede HD PLUS&XCede HD2right angle press-fit daughtercard connectors onto a printed circuit board (PCB). 1 XCede HD 2 Pair Backplane Customer Use Drawings C-923-201C-500 2 Pair, 6 Column Differential Backplane Module, Thick Wall C-923-201E-500 2 Pair, 8 Column Differential Backplane Module, Thick Wall 高速背板系统. 6 XCede RAM and Extended RAM 2 Pair Application Tools 694-4528-000 – 2-Pair RAM Loading Head 1. Description. Signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. English. XCede® Family Cable Assemblies MATERIAL §§Contacts: High performance Copper Alloy §§Plating(s): Performance-based plating at separable interface (Telcordia GR-1217-CORE) §§Housings: High Performance Thermoplastic, UL94-V0. use keep out zone. screw length and part number are dependent on daughtercard thickness (as specified from configurator). DETAILS. Español $ USD United States. DC Connector Configurations. 7mil Drill Minimum Pad Size vs. Xcede Group is a global recruitment organisation that delivers technology and energy talent solutions which enable companies to innovate and grow. Page 174 Figure 127. An organizer can be used to combine groups of right-angle signal, guide and power modules establishing an integrated daughter card. Additionally, there will be an electro-static. Check Pricing. 2 617-0450-014 xcede hd 4pair stiffener 1 1 922-421f-d3h xcede hd 4pair lc mod w/ organizer, 8pos, 100ohms, bifurcated, . ExaMAX® enables up to 56 Gbps performance and allows designers the option to optimize density or minimize board layer count. SCOPE Content This specification covers the performance, test and quality requirements for XCede product family interconnect systems. Login or REGISTER Hello, {0}. § Differential pairs 28-84 per inch (11-33 differential pairs perAmphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Combination signal and power edge card system with rugged Edge Rate® contacts and performance up to 60 A per power bank. The XCede ® HD Plus backplane connector achieves high . Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. HDTM. 3. XCede HD, XCede HD PLUS & XCede HD2 press fit backplane connector family onto a printed circuit board (PCB). DC Connector Configurations. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Resource The top level of the. Each port offers 4 channels to increase port density which contributes to more board real estate and immense cost savings. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Mouser offers inventory, pricing, & datasheets for Amphenol XCede HD Series High Speed / Modular Connectors. We work with businesses, from pioneering start-ups to global brands, to find project-based or permanent talent that enables innovation in line with their vision and goals. The connectors are intermatable, electrically and mechanically interchangeable. RF Connectors Valcon IPEX Type RF Samtec Bulls Eye® RF Samtec Ganged RF. 9 signal pairs/inch and can be used down to 25 mm card slot pitch. XCede ® HD2 §Integrated Circuits IGBTs MOSFETs Discrete Semiconductors RF and Microwave Passives Motors & Actuators Microphones & Speakers Connectors Electronic Materials Thermal Management LCD&LED Displays Automation & Control Power & Batteries Test & Measurement Mechanical and Metal Parts Tools;. Login or REGISTER Hello, {0}. 3. Receptacle connectors and pin connectors are through hole devices with eye-of-the-needle compliant pin contacts. Farnell Israel offers fast quotes, same day dispatch, fast delivery, wide inventory, datasheets & technical support. Contact us today for more details of XCede HD, part number 968-4200-A1H. 4 differential signal pairs/inch. 2. 9 signal pairs per inch are. We chose the Asus Prime X470-Pro for its inclusion of many modern. Rugged Edge Rate® contact system. As a high-density, high-speed backplane connector, the XCede ® HD product line provides a robust solution for tighter card pitches and chassis designs where space requirements and. Login or REGISTER Hello, {0}. English Deutsch Français Español Português Italiano Român Nederlands Latina Dansk Svenska Norsk Magyar Bahasa Indonesia Türkçe Suomi Latvian Lithuanian česk. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with cooling. KK connector systems are customizable for a variety of power and signal applications. Discover More. This connector ships without wires, terminals and seals. Login or REGISTER Hello, {0}. XCede® Backplane Connector MATERIAL §§Housing: Liquid Crystal Polymer §§Contact Base Metal: Copper Alloy §§Plating: Performance-based plating at separable interface; meets requirements of product specification ELECTRICAL PERFORMANCE §§Signal Current Rating: 1A per contact §§Ground Current Rating: 2A per contactJ-Tech, Inc. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 7. Mouser offers inventory, pricing, & datasheets for Samtec XCede High Speed / Modular Connectors. 3. Ruggedized design for high reliability and ease of application. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede ® HD Plus connector meets the high density needs of today's challenging architectures. 5 application, evolved up to the further PCIe Gen. Integrated guidance, keying and polarizing side walls available. 2. 2. XCede® connectors also address. This was soon replaced by DIMM with a 64-bit data path. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with cooling. BAcKpAneL connectors Fci’s Xcede® connector platform is designed for 20+ Gb/s performance to provide the headroom to support future high-speed, serial data rate requirements demanded by next-generation equipment in data centers and service provider networks. English. com. 2. 3、4和6对设计. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. XCede® connectors also address. 00: L: Pressfit: 5: Power or coax contacts, Multi Purpose Centre, Location Peg1. XCede connectors also address requirements for higher linear signal density at the backplane or midplane interface. XCede® connectors also address. EN. § Differential pairs 28-84 per inch (11-33 differential pairs perBack view of 24 x 2. 下载3D模块 配置并加入到购物车 配置免费样品 技术参数. XCede® HD 1. 1. 00mm pitch (FF5026) and 050mm pitch (FF3025). . 1. XCede® Family Cable Assemblies MATERIAL §§Contacts: High performance Copper Alloy §§Plating(s): Performance-based plating at separable interface (Telcordia GR-1217-CORE) §§Housings: High Performance Thermoplastic, UL94-V0. The XCede ® I/O interconnect system is comprised of a 32 position, variable pitch connector built for use in high speed serial applications. 3. Across our key areas, our experts operate with a. 2" long and has an x4 connector. Connectors in the dataspace can handle unified message exchanges by returning data model-compliant responses to data requests. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 4、6或8列. Backwards mate compatibility. Samtec XCede® HD 3. Mouser offers inventory, pricing, & datasheets for XCede High Speed/Modular Connectors. 2. Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions. Change Location. XCede® connectors also address. Newark offers fast quotes, same day shipping, fast delivery, wide inventory, datasheets & technical support. 1. XCede® connectors also address. 2-, 3-, 4-, 5-, 6-Pair configurations. Mouser offers inventory, pricing, & datasheets for XCede Connectors. Yelp is a fun and easy way to find, recommend and talk about what’s great and not so great in Victoria and beyond. This merger brings together three specialist technology talent solution companies that creates a group with £100m revenue, 650 onsite contractors and 220 internal employees across 9 global offices. 3. XCede® connectors also address. Attention! Your ePaper is waiting for publication! By publishing your document, the content will be optimally indexed by Google via AI and sorted into the right category for over 500 million ePaper readers on YUMPU. The stiffener may help straighten the board edge, but this does not necessarily preclude the need for additional board stiffening. refer to c-922-4x0a-500 for signal connector detail. Buy XCede HD Series Backplane Connectors. Login or REGISTER Hello, {0}. 0217" Drill XCede HD & XCede HD PLUS press fit backplane connector family onto a printed circuit board (PCB). Please confirm your currency selection:Buy XCede HD Series Backplane Connectors. Data rates capable up to 28 Gb/s to support system upgrades without costly redesigns. TARGET MARKETS. XCede® RAM. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 3. Wang 6/19/19. 2 The XCede product family encompasses XCede, XCede Plus, and X2 product lines, and their corresponding product derivatives including; daughtercard, backplane, mezzanine, right-angle-male (RAM), orthogonal, right-angle-male Amphenol Communications Solutions XCede high-performance backplane connector system. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Integrated Circuits IGBTs MOSFETs Discrete Semiconductors RF and Microwave Passives Motors & Actuators Microphones & Speakers Connectors Electronic Materials Thermal Management. Shear Stud Connectors. 65; 29 In Stock; New Product; Mfr. DC Connector Configurations XCede HD connector system. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with cooling. XCede HD achieves the highest performance in an HM compatible form factor. View Substitutes & Alternatives along with datasheets, stock, pricing and search for other Backplane Connectors products. Login or REGISTER Hello, {0}. 1. Advanced Search. The Molex EXTreme LPHPower Connector is a mixed, high current power and signal connector system that picks up where traditional connectors leave off. 1 DOCUMENTS 2. Contact Mouser (USA) (800) 346-6873 | Feedback. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede ® HD Plus connector meets the high density needs of today’s . Newark offers fast quotes, same day shipping, fast delivery, wide inventory, datasheets & technical support. Article: 00028492. XCede HD achieves the highest performance in an HM compatible form factor. 使用Samtec的高速板对板Solutionator®构建您的对接连接器套件 。. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Buy 928-4050-A7H - Amphenol Communications Solutions - Connector, 4 Diff Pair, XCede HD Plus Series, Receptacle, Press Fit. 1. 4, 6 or 8 columns. 2 Host Interface Connector The BCM957504-N425G OCP network adapter interfaces with the system baseboard via the gold fingers compliant with the SFF-TA-1002 specification. 3 - 8 CARBURTON STREET, LONDON, W1W 5AJ. 6. Find Parts Learn More. 1. XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. We work with businesses, from pioneering start-ups to global brands, to find project-based or permanent talent that enables innovation in line with their vision and goals. XCede® BACKPLANE CONNECTOR SYSTEM DESCRIPTION XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. The XCede product family encompasses XCede®, XCede Plus®, and X2 product lines, and their corresponding product derivatives including; Daughtercard, backplane, mezzanine,. Features. 7. 00 mm contact wipe on signal pins. XCede ® HD2 was introduced to support PCIe ® 5 and XCede ® HD3 (in development) is targeting support of 112G PAM4 with future PCIe ® Gen 6 support in. Reboot the switch to enable the change. Revision “D” Specification Revision Status . 2. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 54 - 5. Designed to meet UL 1977 CAF (Conductive Anodic Filament) spacing Housing: High-temperature thermoplastic, UL94-V0 Wafers: High-temperature thermoplastic, UL94-V0 Contacts: High-performance copper alloy Platings. Receptacle connectors and pin connectors are through hole devices with eye-of-the-needle compliant pin contacts. 1. XCede® connectors also address. Welcome to Wille Dodge, a family-owned dealership with 44 years of. 60mm Gen-Z connectors conform to SFF-TA-1002, OCP NIC 3. These connectors are two-piece devices that connect two printed circuit boards. They're small enough for most consumer RF applications and they use a threaded housing to create strong mechanical connections. See section 4 regarding XHD+ RAM connectors. XCede HD achieves the highest performance in an HM compatible form factor. 4. XCede connectors also meet higher linear signal density requirements at backplane or midplane interfaces. 80 mm column pitch. 4 differential pairs/inch. 20mm Power Modules. 2. Type S (same-side) and Type O (opposite-side) contact layouts allow for mirrored contacts. TARGET MARKETS. Mouser offers inventory, pricing, & datasheets for XCede High Speed / Modular Connectors. 1. Integrated power and guidance. Copper Weight and Annular Ring (“A/R”) 8 Table 3: XCede® HD 21. see tb-xxxx for board weight limitations. Distance Curve of MEP-12T press for XCede and XCede Plus connectors. XCede® Connectors - Amphenol CS | DigiKeyXCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. High-density backplane system – up to 84 differential pairs per linear inch. 2 - One mezzanine card per node, mirrored ; 3 - Two IO Modules per node, mirrored. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with coolingComponents. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 1. It is intended to provide general guidance for development of customer designs It is intended to provide general guidance for development of customer designs and application processes as they relate to this product family. DDR-SDRAM stands for Double Data Rate - Synchronous Dynamic Random Access Memory and it is a common type of memory used-organized RAM in most of the processors. XCede® connectors also address. Guidance and keying options. Samtec XCede High Speed / Modular Connectors are available at Mouser Electronics. Mouser offers inventory, pricing, & datasheets for XCede High Speed/Modular Connectors. XCede® connectors also address. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. We offer interconnection systems from 2. XCede ® HD and XCede ® HD Plus, this connector provides . 0 REFERENCE 2. Accessories; Audio Products; Capacitors; Circuit Protection; Circuit Breaker Protection Devices ExplainedDislaime Please note that the above information is subject to change without notice. TARGET MARKETS. This document describes the methods and tooling for the installation of Amphenol TCS XCede HD,XCede HD PLUS&XCede HD2right angle press-fit daughtercard connectors onto a printed circuit board (PCB). 2 The daughtercard connector building blocks include signal modules, power modules, guidance/polarizing modules and grounded guidance modules that are all assembled to a metal organizer (stiffener). element14 Malaysia offers special pricing, same day dispatch, fast delivery, wide inventory, datasheets & technical support. backplane to expander board connector (BP_XCEDE_3) 2. Login or REGISTER Hello, {0}. Each ball and socket mount is designed and manufactured using the highest quality materials, and is backed by a lifetime warranty. Figure A-9 shows this requirement pictorially. Search for: Search Home; Categories. developers with a readily available robust solution for tighter card pitches and chassis designs where space requirements and density are critical. 3-, 4- and 6-pair designs; 4, 6 or 8 columns; Standard or high-speed wafers available; 85 Ω and 100 Ω options; Modular design provides flexibility in applications The XCede HD interconnect platform also has available RAM (Right Angle Male). Pin header. Revision SCR No. 80mm Right-Angle Backplane Receptacle; HDTF - Samtec XCede® HD 1. Amphenol is the leader in high-speed, high-density connection systems, designing and manufacturing the industry's leading connectors and backplane systems. Complementary guide and power modules are also included in the product range. 2 The daughtercard connector building blocks include signal modules, power modules,. The stiffener may help straighten the board edge, but this does not necessarily preclude the need for additional board stiffening. Figure 20: Example XCede® HD Midplane Connector 20 LIST OF TABLES Table 1: XCede® HD , XCede® HD Plus and XCede® HD2 15. After the reboot, the 40G port light turns yellow, which means the 40G-10G split configuration is successful. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. These connectors are two-piece devices that connect two printed circuit boards. XCede ® HD and XCede ® HD Plus, this connector provides . The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 2. Power blades rated up to 60 A per power bank. the use of advanced engineering polymers in a unique 3-D resonance. Three levels of sequencing enable hot plugging. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Xcede's first Data Networking Event in Manchester was a great success, and we can't thank the incredible team at Moneysupermarket enough for co-hosting with us at their fantastic Manchester office. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 3-, 4- and 6-pair designs; 4, 6 or 8 columns; Standard or high-speed wafers available; 85 Ω and 100 Ω options; Modular design. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Click OK to extend your time for an additional 30 minutes. Features & Benefits. Description Initial Date “A” S2401 Initial Release E. These connectors are available in 3-, 4- and 6-Pair configurations. 3-, 4- and 6-pair designs. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 高速、高密度背板系统包括了各种对数和列数的ExaMAX®和XCede® HD。. com. We would like to show you a description here but the site won’t allow us. 2. Kuject 320 PCS Heat Shrink Wire Connectors, Multipurpose Waterproof Electrical Wire Terminals kit, Insulated Crimp Connectors Ring Fork Spade Butt Splices for Automotive Marine Boat Truck. Integrated Circuits IGBTs MOSFETs Discrete Semiconductors RF and Microwave Passives Motors & Actuators. Figure 14: Typical Force vs. High-speed, high-density backplane systems include ExaMAX ® and XCede ® HD in a variety of pair and column counts. 384 likes · 6 talking about this · 259 were here. § Differential pairs 28-84 per inch (11-33 differential pairs per10120130-L0J-20DLF Datasheets | Backplane Connectors - Specialized Connector Header, Male Pins and Blades Through Hole Black XCede®, Left Wall By apogeeweb, 10120130-l0j-20dlf, 10120130-l0j-20dlf datasheet,10120130-l0j-20dlf pdf,amphenol icc (fci)Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. The XCede backplane connector system provides mechanical longevity and ruggedness required by today’s systems. FEATURES. 80 mm column pitch. Choice of 2 or 4 power banks. a SFP+ adapter that's super-short 3. 4 - Four (4) Onboardports by default . power connector (J_PWR_B) 7. XCede PRODUCT FAMILY DAUGHTERCARD MODULE REMOVAL AND REPLACEMENT . XCede® BACKPLANE CONNECTOR SYSTEM - FCI. EIA-364-B Electrical Connector Test Procedure Including Environmental Classifications 2. Mechanical longevity and ruggedness. Submit a Brief. Receptacle connectors and pin connectors are through-hole devices with eye-of-the-needle compliant pin contacts. XCede Connectors are available at Mouser Electronics. Contact us today for more details of XCede HD, part number 968-4200-A1H. XCede® Connectors - Amphenol CS | DigiKeyAmphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 2. 7. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. See Figure 15 for details. See section 4 regarding XHD2 RAM connectors. 1. 1. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. XCede® Connectors - Amphenol CS | DigiKey2020 Dodge Ram 1500 TIPM Module Connector (G36C42) TIPM Module Connector (G36C42) (3) List Price. Amphenol Communications Solutions XCede high-performance backplane connector system. 2. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Mouser offers inventory, pricing, & datasheets for XCede Connectors. XCede® connectors also address. 1. 0 specification. 2 The XCede product family encompasses XCede, XCede Plus, and X2 product lines, and their corresponding product derivatives including; daughtercard, backplane, mezzanine, right-angle-male (RAM), orthogonal, right-angle-male Figure 20: Example XCede® HD Midplane Connector 20 LIST OF TABLES Table 1: XCede® HD , XCede® HD Plus and XCede® HD2 15. 08mm. XCede® HIGHdPERFORMANCE BACKPLANE CONNECTOR. Spacone 5-29-12 The XCede® Right-Angle Male (XCede® RAM) connector allows designers to grow their systems horizontally or add a new cabling solution by creating traditional. DETAILS. Integrated power, guidance, keying and side walls available. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 2. XCede ® HD is a small form factor system with a modular design for significant space savings and. The XCede product family encompasses XCede, XCede Plus, and X2 product lines, and their corresponding product derivatives including; daughtercard, backplane, mezzanine, right-angle-male (RAM), orthogonal, right-angle-male direct-attach orthogonal (RAM DA ortho. Vertical backplane header configurations provide two, four or six differential signal pairs per column wafer with four, six or eight wafers per signal connector module. Features & Benefits. EN. XCede® connectors also address. XCede. jx410-51594 rev drawing no.